DSGK-070 Surveying and mapping robot motherboard

1. Product Introduction

1.1 Product Overview

Based on Rockchip RK3588 Designed for Static mapping machine A high-performance Embedded motherboard products. DSK-070 has an 8-core CPU, 6TOPS independent NPU computing power, strong AI capabilities, and includes USB and MIPI rich peripheral interfaces to fully meet Access requirements for robot multi-sensor perception and control blocks, suitable for harsh outdoor environments. It supports flexible selection of operating systems, with Android system as standard, and can also independently run Android/Linux+RTOS fusion operating system. It is mainly used in mapping robot scenarios that require high performance and high computing power.

1.2 Hardware Specifications

Name	Describe
Product Model	DSGK-070
CPU	RK3588
RAM	8GB
EMMC	128GB
System	Android 12
PCIE3.0	4Lan, 2280 external SSD, maximum capacity up to 2TB
Network port	1 10/100/1000Mbps Ethernet interface
USB3.0 interface	2 USB3.0 HOST interfaces, 1 USB3.0 OTG interface
Wi-Fi	Wi-Fi6, 802.11a/b/g/n/ac/ax 1200Mbps WLAN + BT v5.2, 2 ipex antenna sockets
Audio	Support, can connect an external 8 ohm/2W speaker
video	Support, 1 MIPI DSI interface, 4Lan
RTC	Yes, with spare CR1220 battery holder for non-rechargeable batteries
Debug interface	Support, 1 UART interface on board
button	1 power button
	1 hard reset button
	1 RECOVERY button
	1 MASKROM button
Cooling Solution	Support radiator + fan
Sensor interface	Support external six-axis gyroscope sensor and magnetometer sensor
LED	Flash control interface
	Bluetooth working status indicator light control interface
	Wifi working status indicator light control interface
power supply	DC power supply voltage range 12V/2A and battery power supply voltage range 9V to 12V
Operating temperature	-10 to 70 degrees
Storage temperature	-20 to 80 degrees
PCBA Dimensions	100*101.5mm

1.3 Product Application Diagram

1.3.1 Hardware Application Block Diagram

1.3.2 System Software Block Diagram

Dusun integrates relevant applications of the robotics industry on the basis of standard systems. custom made High reliability Operating system and industry SDK, With many years of experience in the development and design of robot embedded motherboards, we have completed the transplantation and testing of various hardware peripheral drivers that meet industry applications. The following is the software framework of the default Android system of DSGK-070.

In addition, Dusun can Provide independent system support for various versions of Linux, such as Debian, Ubuntu, etc.It can also support the multi-core fusion system of AMP Android/Linux +ROTS, and has good performance in real-time control and complex algorithm support.
Dusun provides the robot industry SDK source code that matches the surveying and mapping robot motherboard, supporting customers to conduct micro-development to achieve rapid productization. Dusun Robot Industry The SDK has the following features:
1. Streamlined operating system: On the premise of meeting industry applications, the number of components is streamlined, the system resource utilization rate is high, thereby reducing hardware costs, and to a certain extent, the functional structure is optimized, the system architecture is reasonably laid out, and the system is more efficient and easy to maintain;
2. BSP with industry attributes: According to the types of peripheral devices used in the industry, driver transplantation and debugging are carried out and industry algorithms are adapted to meet the customer’s needs for selecting an overall hardware + algorithm solution. In addition, Dusun BSP driver will continue to iterate the access to peripheral devices of different brands and models.
3. Pre-installed tools and middleware: Pre-install NPU’s big data model tools (such as ONXX, etc.) and the middleware ROS/ROS2 of the robotics industry in advance, so that users can quickly transplant applications and tree models of other hardware platforms and achieve low-cost hardware platform switching.

1.3.3 Supported algorithms and peripheral hardware

1.3.3.1 Basic equipment

Peripherals	model	illustrate
fan	DB7505h05S	Support PWM speed control Support speed FG signal reading back
trumpet	--	8W speaker
MIPI Touch LCD	Hongguang HG050HD026T01	Resolution 720x1280 Capacitive touch
USB Camera	--	Universal UVC
External expansion USB flash drive	TinkPad/Patriot/Kingston mainstream models	Universal 3.0/2.0 USB flash drive

1.3.3.4 Core Components

Core Algorithm	Matching peripheral hardware	model	illustrate
SLAM Algorithm	LiDAR + Binocular Camera	SLAMTEC Aurora
	Magnetometer	AK09915c
	Six-axis gyroscope	ICM-42688
Face recognition algorithm	Structured light module	RMSL321	RK NN Deep Algorithm
Intelligent voice algorithm	6-microphone circular array	Can be customized according to structure	Sound pickup and noise reduction, keyword wake-up, voice wake-up
Monocular ranging algorithm	Structured light module	RMSL321	Distance and angle information of visual obstructions

Note: The above algorithms are not pre-installed in the factory firmware version. If necessary, please contact the corresponding technical window

1.3.4 Supported Algorithm Models

Big data model tools are pre-installed in the product SDK: RKNN API, TensorFlow Lite; ONNX Runtime; ONNX Runtime, Android NNAPI

2. Installation Instructions

2.1 Packaging instructions

1.Shipping packaging bag: anti-static sealing bag (as shown below);

3.Product weight: 150g±5g;
4.The product is packed in boxes, 100 pieces per box, as shown in the following figure. (One piece of product is placed in a gap, and there are two layers of gaps in total, which can hold 100 pieces of products)

2.2 Accessories List

1、The product leaves the factory without accessories

2.3 Installation

1、The product is fixed by 4 screws (the fixing hole positions are shown in the figure below). The screw hole diameter is 3.3±0.15mm. It is recommended to use M3mm cross pan head screws.

2、The product can be equipped with a core board and a core board radiator. The radiator size is recommended to be as follows:

The radiator is fixed to the product with 4 screws. The recommended screw specifications are: M2X14mm, cross pan head screws.

3.It is recommended that both sides of the board be limited to ≥45mm (depending on the actual shell design requirements)

2.4 Product Dimensions

3. Hardware Instructions

3.1 Product Appearance

none

3.2 Product IO Interface Diagram

3.2.1 Interface Identification Diagram

3.2.2 Interface Function Description

Serial number	describe	Remark
1	Power button	Not external, for debugging
2	RECOVERY button
3	Hard reset button
4	MASKROM button
5	Fan connector	Reserved core board cooling fan interface
6	USB3.0 HOST0 interface	External USB flash drive
7	Flash control interface	External flash light board
8	60pin adapter	The 60-pin pins include: power supply input pin; 1 8 ohm/2W speaker interface; screen backlight driver; Wifi working status indicator light control interface; screen touchpad control interface; Ethernet interface; screen MIPI DSI interface and other control signals
9	USB3.0 HOST2 interface	Connecting a Camera
10	Debug interface	1 UART interface, CMOS level, level 3.3V, 1.25mm pitch, 3Pin socket
11	USB3.0 OTG interface	Type C interface, external dongle
12	Wifi module	Wifi6 module, 802.11a/b/g/n/ac/ax 1200Mbps WLAN + BT v5.2, SDIO interface, 2 ipex antenna sockets
13	Wifi main antenna for Wifi
14	Wifi secondary antenna and Bluetooth 2-in-1 antenna
15	After the ipex sockets 13 and 14 are installed with antennas, a board will be used to press the connector of the ipex antenna, and 15 and 16 will fix the pressing board with screws.	The recommended fixing screw size is M2*4mm
16		The recommended fixing screw size is M2*4mm
17	Firmware burning interface	Software program for burning PCBA
18	Bluetooth working status control interface
19	Sensor interface	External sensor board, which has six-axis accelerometer and magnetometer sensor
20	RK3588 core board	The core board is connected to the main board through four board-to-board connectors, and the four nut columns on the main board are used to fix the core board. The capacity of the core board RAM is 8GB, and the capacity of the EMMC is 128GB
twenty one	SSD interface	It uses an M.2 slot, PCIE3.0 4Lan, and can expand a 2280 solid-state hard drive with a maximum capacity of 2TB
twenty two	System backup battery interface	Used for external 12V lithium battery, the lithium battery itself has power measurement function
twenty three	RTC Backup Battery Holder	CR1220 battery holder, for non-rechargeable batteries

3.2.3 Interface Usage Description

3.2.3.1 Instructions for use of core board interface

①The mainboard uses the Dusun RK3588 core board (DSOM-040R). The position of the core board on the PCBA is shown in the figure below:

In the above figure, J13, J14, J15 and J16 are the four columns for fixing the core board. The size parameter is M2*3.0, and the corresponding fixing screw size can be M3*6.0mm.
②The actual picture of the core board is shown below:

The core board used on this PCBA has a RAM capacity of 8GB and an EMMC capacity of 128GB.

3.2.3.2 60Pin Interface Instructions

①The pin sequence of the 60-pin interface J34 on the PCBA is shown in the figure below:

The FPC socket is vertical, and the gold finger contacts of the docked FPC lines should face downwards.

Serial number	Pin Name	Pin Description	IO level	Remark
1	GND	Signal Ground	0V
2	MIPI_TX_D0N	MIPI DSI Signaling		Connect to display screen
3	MIPI_TX_D0P	MIPI DSI Signaling		Connect to display screen
4	GND	Signal Ground	0V
5	MIPI_TX_D1N	MIPI DSI Signaling		Connect to display screen
6	MIPI_TX_D1P	MIPI DSI Signaling		Connect to display screen
7	GND	Signal Ground	0V
8	MIPI_TX_CLKN	MIPI DSI Signaling		Connect to display screen
9	MIPI_TX_CLKP	MIPI DSI Signaling		Connect to display screen
10	GND	Signal Ground	0V
11	MIPI_TX_D2N	MIPI DSI Signaling		Connect to display screen
12	MIPI_TX_D2P	MIPI DSI Signaling		Connect to display screen
13	GND	Signal Ground	0V
14	MIPI_TX_D3N	MIPI DSI Signaling		Connect to display screen
15	MIPI_TX_D3P	MIPI DSI Signaling		Connect to display screen
16	GND	Signal Ground	0V
17	TP_VCC3V3	Touchpad I3.3V power supply	3.3V	Touch panel power supply
18	TP_I2C_SCL	Touchpad I2C signal	1.8V	Touch screen communication interface
19	TP_I2C_SDA	Touchpad I2C signal	1.8V	Touch screen communication interface
20	TP_nINT	Touchpad interrupt signal	1.8V	Screen touch panel interrupt output pin
21	TP_nRST	Touchpad reset signal	1.8V	Touch screen reset pin, low level is effective
22	MIPI_LCD_VCC3V3	Display screen I3.3V power supply	3.3V	Display screen power supply
23	MIPI_VCCIO_1V8	Display VCCIO power supply	1.8V	Power supply for the IO signal pins of the display
24	MIPI_LCD_nRST	Display reset signal	1.8V	Display reset pin, low level is effective
25	GND	Signal Ground	0V
26	DD0-	10M/100M/1000Mbps Ethernet network transformer primary side signal		This signal can be directly connected to the RJ45 socket
27	DD0+
28	DC0-
29	DC0+
30	DB0-
31	DB0+
32	DA0-
33	DA0+
34	GND	Signal Ground	0V
35	SET_PWM	Flash light drive signal	3.3V	To connect to the flash interface
36	EN_FLASH	Flash light drive signal	3.3V	To connect to the flash interface
37	SOM_IO_PWR_CHK_H	Power on successfully output pin	3.3V	After the power-on is successful, this pin outputs a high level
38	EN_SOM_POWER	Mainboard power enable signal	3.3V	High level is effective
39	IO_FPGA_PHONE_ON	Display wake-up signal	3.3V	Rising edge is valid, default is low level.
40	SOM_IO_PWR_OFF_t	Soft shutdown signal	3.3V	Rising edge valid , default low level
41	I2C7_SDA_M3	Fuel meter I2C interface	3.3V	This signal is connected to the battery's fuel gauge chip
42	I2C7_SCL_M3	Fuel meter I2C interface	3.3V	This signal is connected to the battery's fuel gauge chip
43	NC			Dangling
44	NC
45	NC
46	NC
47	NC
48	WIFI_LED_K	Wif working status indicator cathode	5V	This signal is connected to an external LED light board
49	WIFI_LED_A	Wif working status indicator light anode	5V	This signal is connected to an external LED light board
50	GND	Signal Ground	0V
51	BK_LED_K	Display backlight driver cathode
52	BK_LED_A	Display backlight driver anode
53	GND	Signal Ground	0V
54	SPK_VOP	Speaker positive terminal		External 8 ohm/2W trumpet
55	SPK_VON	Negative pole of the speaker		External 8 ohm/2W trumpet
56	GND	Signal Ground	0V
57	DC_IN	System power supply	Supply voltage 12+5%, 2A	External DC power input
58	DC_IN
59	DC_IN
60	DC_IN

MIPI display model: HG050HD026T01, manufacturer: Shenzhen Hongguang Display Co., Ltd. The display parameters are as follows:

Item of	Contents	Unit
Panel Size	5.0	inch
LCD Type	a-si/TRANSMISSIVE	/
Display mode	Normally Black	/
Pixel arrangement	7203(RGB)1280	Dots
Pixel pitch(W*H)	0.08625(H)*0.08625(V)	Um
Active Area	62.1(H)*110.4(V)	Mm
Module area(WHT)	76.3(H)137.08(V)3.25(T)	Mm
Recoumended Viewing Direction	ALL	0’clock
LCM IC	ILI9881C	/
TP IC	ILI2511
Interface	MIPI-4	/
Luminance for LCM+TP	400	cd/m2
NTSC	70	%
Weight	TBD	g

②The parameters of FPC socket and FPC line are as follows:

The above are the size parameters of the 60-pin FPC socket and the parameters of the corresponding FPC line.

3.2.3.3 Instructions for using the battery power interface

The pin sequence of the battery power interface J35 on the PCBA is shown in the figure below:

Serial number	Pin Name	Pin Description	IO level	Remark
1	I2C_SCL_M3	Fuel meter I2C interface	3.3V	This signal is connected to the battery's fuel gauge chip
2	I2C7_SDA_M3		3.3V
3	GND	Signal Ground	0V	Connecting the rechargeable lithium battery
4	DC_IN	Battery positive terminal	12V

The dimensions of the battery socket J35 are shown in the figure below:

3.2.3.4 Fan Interface Instructions

The pin sequence of the core board cooling fan interface CON1 on the PCBA is shown in the figure below:

Serial number	Pin Name	Pin Description	IO level	Remark
1	GND	Signal Ground	0V
2	FAN_FG	Fan speed feedback signal	3.3V	This signal can detect the fan speed
3	VCC5V0_FAN	Fan power supply	5V	Fan power supply
4	FAN_PWM	Fan speed PWM control signal	5V	The fan speed is controlled by this PWM signal

This interface is reserved. Whether to add a fan depends on the actual application.
The specifications of the fan socket CON1 are shown in the figure below:

3.2.3.5 Camera interface instructions

①The pin sequence of the camera interface J20 on the PCBA is shown in the figure below:

The FPC socket is vertical, and the gold finger contacts of the docked FPC lines should face downwards.

Serial number	Pin Name	Pin Description	IO level	Remark
1	GND	Signal Ground	0V
2	USB30_2_SSRXP	USB3.0 HOST receiving signal
3	USB30_2_SSRN	USB3.0 HOST receiving signal
4	GND	Signal Ground	0V
5	USB30_2_SSTXP	USB3.0 HOST sends signal
6	USB30_2_SSTN	USB3.0 HOST sends signal
7	GND	Signal Ground	0V
8	USB20_HOST0_DP	USB3.0 HOST DP/DM signal
9	USB20_HOST0_DM	USB3.0 HOST DP/DM signal
10	GND	Signal Ground	0V
11	NC			Dangling
12	NC
13	NC
14	VCC5V0_USB30_HOST1	USB3.0 HOST power output	5V	Maximum external output current 900mA
15	VCC5V0_USB30_HOST1		5V
16	VCC5V0_USB30_HOST1		5V

②The parameters of FPC socket and FPC line are as follows:

The above are the size parameters of the 16-pin FPC socket and the parameters of the corresponding FPC line. Note: The power line (positive and ground line) of the FPC line should be thickened to meet the current requirements. The USB signal line should be made into a differential pair. It is better for the FPC line to have a ground reference plane. It is best to do impedance control. The line sequence should not be punched and crossed, but should be made in a sequential form.

3.2.3.6 U disk interface instructions

①The pin sequence of the USB interface J18 on the PCBA is shown in the figure below:

The FPC socket is vertical, and the gold finger contacts of the docked FPC lines should face downwards.

Serial number	Pin Name	Pin Description	IO level	Remark
1	GND	Signal Ground	0V
2	TYPEC0_SSTX1P	USB3.0 HOST sends signal
3	TYPEC0_SSTX1N
4	GND	Signal Ground	0V
5	USB30_HOST_DM	USB3.0 HOST DP/DM signal
6	USB30_HOST_DP
7	GND	Signal Ground	0V
8	TYPEC0_SSRX1P	USB3.0 HOST receiving signal
9	TYPEC0_SSRX1N
10	TYPEC0_VBUS5V0	USB3.0 HOST power output	5V	Maximum external output current 1000mA

②The parameters of FPC socket and FPC line are as follows:

The above are the size parameters of the 10-pin FPC socket and the parameters of the corresponding FPC line.
Note: The power line (positive and ground line) of the FPC line should be thickened to meet the current requirements. The USB signal line should be made into a differential pair. It is better for the FPC line to have a ground reference plane. It is best to do impedance control. The line sequence should not be punched and crossed, but should be made in a sequential form.

3.2.3.7 Flashlight Interface Instructions

①The pin sequence of the flash interface J33 on the PCBA is shown in the figure below:

The FPC socket is vertical, and the gold finger contacts of the docked FPC lines should face downwards.

Serial number	Pin Name	Pin Description	IO level	Remark
1	FLASH_LIGHT_VCC5V0	Flash board power output	5V	Maximum external output current 1580mA
2	FLASH_LIGHT_VCC5V0		5V
3	FLASH_LIGHT_VCC5V0		5V
4	FLASH_LIGHT_VCC5V0		5V
5	FLASH_LIGHT_VCC5V0		5V
6	FLASH_LIGHT_VCC5V0		5V
7	SET_PWM	Flash light drive signal	3.3V	To be connected to the flash board, not controlled by the main board
8	EN_FLASH	Flash light drive signal	3.3V
9	GND	Signal Ground	0V
10	GND	Signal Ground	0V
11	GND	Signal Ground	0V
12	GND	Signal Ground	0V
13	GND	Signal Ground	0V
14	GND	Signal Ground	0V

②The parameters of FPC socket and FPC line are as follows:

The above are the size parameters of the 14-pin FPC socket and the parameters of the corresponding FPC line.

3.2.3.8 Debug interface usage instructions

The pin sequence of debug interface CON2 on PCBA is shown in the figure below:

Serial number	Pin Name	Pin Description	IO level	Remark
1	GND	Signal Ground	0V
2	DEBUG_TXD	UART sends signal	3.3V	UART signal is CMOS level
3	DEBUG_RXD	UART receiving signal	3.3V

The specifications of the debug interface connector CON2 are shown in the figure below:

3.2.3.9 Instructions for using the dongle interface

The pin sequence of dongle interface J19 on PCBA is shown in the figure below:

The above is a standard 24-pin Type C interface. This interface can be used as a Type C OTG interface. For connecting a dongle module, it is used as a USB3.0 HOST mode, and the maximum external output current is 1000mA.

3.2.3.10 Instructions for using the firmware burning interface

The pin sequence of the firmware burning interface J17 on the PCBA is shown in the figure below:

The above is a standard 24-pin Type C interface. However, the USB2.0 signal in Type C is actually used to burn the software program of PCBA.

3.2.3.11 Bluetooth working status indicator interface usage instructions

①The pin sequence of the firmware burning interface J17 on the PCBA is shown in the figure below:

The FPC socket is vertical, and the gold finger contacts of the docked FPC lines should face downwards.

Serial number	Pin Name	Pin Description	IO level	Remark
1	BT_LED_K	Bluetooth working status indicator cathode	5V	The cathode of the LED is connected to the collector of the transistor
2	BT_LED_K	Bluetooth working status indicator cathode	5V
3	BT_LED_A	Bluetooth working status indicator anode	5V	The LED anode is connected to a 5V power supply and a 200 ohm resistor is connected in series.
4	BT_LED_A	Bluetooth working status indicator anode	5V

②The parameters of FPC socket and FPC line are as follows:

3.2.3.12 Sensor Board Interface Instructions

①The pin sequence of the sensor board interface J29 on the PCBA is shown in the figure below:

Serial number	Pin Name	Pin Description	IO level	Remark
1	SENSOR_VCC3V3	Sensor 3.3V power supply	3.3V
2	SENSOR_I2C_SCL	Sensor I2C signal	1.8V	The I2C interface of the six-axis accelerometer and magnetometer shares this signal
3	SENSOR_1V8	Sensor 3.3V power supply	1.8V
4	SENSOR_I2C_SDA	Sensor I2C signal	1.8V	The I2C interface of the six-axis accelerometer and magnetometer shares this signal
5	GND	Signal Ground
6	COMPASS_nRST	Six-axis acceleration sensor reset signal	1.8V	Low level is effective
7	ACCELEROMETER_nINT	Magnetometer sensor interrupt output signal	1.8V	Falling edge valid
8	COMPASS_nINT	Six-axis acceleration sensor interrupt output signal	1.8V	Falling edge valid
9	GND	Signal Ground	0V
10	GND	Signal Ground	0V

Sensor boardSix-axis acceleration sensor chip modelICM-42688, geomagnetic sensor chip model AK09915c.

②Dimensional parameters of double-row pin headers and female headers
The size parameters of the double-row curved pins of J29 on the PCBA are as follows:

The corresponding size parameters of the double-row female header are shown in the figure below:

3.2.3.13 Instructions for using the SSD interface

The location of the SSD interface J21 on the PCBA is shown in the following figure:

J21 is the connector of M.2 M KEY. PCIE3.0*4Lan, can expand 2280 size solid state drive, with a maximum capacity of 2TB.
J37 is the column supporting the solid-state drive. The size of the column is M3*2.5mm, and the corresponding fixing screw size can be M3*5.0mm.

3.2.3.14 RTC backup battery interface usage instructions

The location of the RTC backup battery holder BT1 on the PCBA is shown in the figure below:

There is an RTC real-time clock circuit on the motherboard. The CR1220 battery holder on the motherboard uses a non-rechargeable CR1220 button battery. When the system power is cut off, the CR1220 battery is used to power the RTC chip to maintain the normal operation of the time in the RTC chip.

3.2.3.15 Button Usage Instructions

There are four buttons on the motherboard, from left to right: power button, RECOVERY button, hard reset button and MASKROM button.

①Power button
In shutdown state, press the power button for 20ms and the main control will turn on. If in power-on state, press the power button to send a short press or long press interrupt to the main control. If the pull-down time exceeds 6S, it will be forced to shut down (6S, 8S, 10S, 12S software selectable).
②RECOVERY button
Press the RECOVERY button, the system enters the RECOVERY state, under the premise that no button action is performed and the system has been burned with firmware, power on and enter the system directly; if the RECOVERY mode button is pressed when the system starts, RK3588 enters the Loader burning mode, when the PC recognizes the USB device, release the RECOVERY button to burn the firmware.
③Hard reset button
The hard reset button signal is connected to the hardware reset pin of the core board. Press this button and the core board will reset and restart.
④MASKROM button
MASKROM is a dedicated pin for BOOT configuration, which determines the system startup sequence. This pin cannot be used for other functions. Press the MASKROM button, power on the core board again or press the reset button to put the device into the MASKROM state.

3.2.3.16 Wifi Usage Instructions

The location of Wifi module U22 on PCBA is shown in the figure below:

Wifi module supports IEEE802.11a/b/g/n/ac/ax 1200Mbps WLAN + BT v5.2, working frequency band2.4~2.4835GHz or 5.15~5.85GHz,2 ipex antenna sockets. Note: If you need detailed parameters of the WIFI module, please contact our sales to obtain relevant information.

3.3 Status indicator light description

There are two network port indicators on the PCBA, LED1 and LED2, which are placed inside the board for debugging and testing. The positions of LED1 and LED2 on the PCBA are shown in the figure below:

Serial number	name	color	state	Remark
1	LED1	green	Light = Link up at 100Mbps Blinking = Transiting or Receiving	The corresponding position number on the PCBA is D13
2	LED2	yellow	Light = Link up at 1000Mbps Blinking = Transiting or Receiving	The corresponding position number on the PCBA is D14

The flashing frequency can be configured through ext Reg0xA00F.
Bit3:0 Flashing frequency:
0000——2Hz;
0101——4Hz;
1010——8Hz;
1111——16Hz.
Bit6:4 Flashing duty cycle (On: Off):
000: 50% ON and 50% OFF;
001: 67% ON and 33% OFF;
010: 75% ON and 25% OFF;
011: 83% ON and 17% OFF;
100: 50% ON and 50% OFF;
101: 33% ON and 67% OFF;
110: 25% ON and 75% OFF;
111: 17% ON and 83% OFF.

4. Software Instructions

4.1 Introduction to motherboard buttons and interfaces

4.1.1 Button Description

Serial number	interface	illustrate
1	power button	Sleep/Wake button
2	loader button
3	Reset button
4	maskrom key

4.1.2 Interface Description

Serial number	interface	illustrate
5	Fan connector
6	3.0 USB interface
7	Flash board interface	bypass
8	60pin adapter	Transfer LCD, Ethernet port, wifi LED indicator
9	USB camera interface
10	Debug serial port	TTL 3v3
11	TypeC dongle interface
12	TypeC firmware burning port	The same channel as the 3.0 U disk interface. After the kernel is started, it is configured as a 3.0 host and switched to the U disk interface.
13	Sensor interface	External compass board
14	Bluetooth wifi antenna
15	Bluetooth LED
16	PCIE solid state drive interface
17	RTC battery interface
18	Power interface

4.2 Debug serial port parameter settings

4.2.1 Download PC serial port tool

It is recommended to use MobaXterm to access, the recommended download address is: https://mobaxterm.mobatek.net/ download-home-edition.html
The effect after the tool opens the serial port is as follows:

4.2.2 Serial port settings

l Debug serial port baud rate 1500000
18 data bits
1 stop bit
No verification
No flow control
Please note that there is no 1500000 in the serial port baud rate drop-down box. You need to enter it directly.
See the figure below for details

4.2.3 Serial port connection diagram

4.3 Firmware Burning

4.3.1 Preparation

Prepare the Materials	illustrate
Burning PC	Windows 7 and above
RKDevTool	v2.93 and above
USB type C cable

4.3.2 SDK application and download

4.3.2.1 Apply for SDK

The SDK versions of different Dusun chip platforms need to be applied to the corresponding business end respectively. For example, your company has received the SDK for RK3288, and now there is a new project that requires the SDK for RK3588. We need to contact the corresponding business end of Dusun for business confirmation, and the business end will assist in the application. After approval by Dusun auditors, the technical department can disclose information to your company.
Notice:
The SDK code management released by Dusun follows Google’s REPO method. Users are not recommended to delete the SDK’s REPO and GIT version records.

4.3.2.2 Generate server key

Enter on the server command line

				
					ssh-keygen -t rsa -C " xxxx@xxxx.com "

Keep pressing Enter and do not enter the task characters;
After generating the key, email the ~/.ssh/id_rsa.pub file to Dusun

4.3.2.3 Git Configuration

Enter on the server command line:

				
					git config --global user.email " You@example.com "
git config --global user.name "Your Name"

4.3.2.4 SDK download [need to update the download address]

Download the repo

				
					git clone ssh:// git@roombanker.x3322.net :2223/dusun_repo.git

Add environment variables

				
					sudo cp -f ~/work/dusun_repo/repo /usr/bin/repo
sudo chmod +x /usr/bin/repo

Get the code Please note that each document should modify the repo init address to the corresponding project.

				
					mkdir -p ~/work/project/dev
cd ~/work/project/dev
repo init -u ssh:// git@roombanker.x3322.net :2223/xxxx
repo sync -c -j8
repo start master --all

4.3.3 Download the burning software tool

4.3.3.1 Download PC flash tool

Flashing tool link: Baidu Netdisk please enter the extraction code Extraction code: d50y

4.3.3.2. PC driver download

The computer needs to install the adb USB driver: Baidu Netdisk please enter the extraction code Extraction code: hka6

4.3.4 Firmware Burning

4.3.4.1 Flash connection diagram

4.3.4.2 Flashing steps

1. One end of the USB data cable is connected to the host, and the other end of the Type-C cable is connected to the firmware burning port of the device.
2. Power on the device
3. Press and hold the maskrom or loader button, then short press the reset button for 1 second and release it, the device enters the maskrom mode or loader mode (the core board in loader mode must be burned with firmware before entering)
Open RKDevTool_Release_v2.93 flashing tool, click Firmware, and select Upgrade Firmware

5. Click Upgrade and wait for the flashing to complete

4.4 SDK Introduction

Hardware Environment
Hard disk: 500G or more
Memory: 16G or more
Software environment: It is recommended to use the distribution version Ubuntu 20.04
Update the packages that the compilation depends on

				
					sudo apt-get update
sudo apt-get install build-essentil flex bison libssl-dev libncurses5

4.4.1. Compile Commands

Compilation steps

				
					#Enter the SDK directory
cd RK3588_ANDROID12.0_SDK_070_RELEASE_XXX
# Initialize the compilation environment
source build/envsetup.sh
#Choose the platform you need to compile
lunch rk3588_ds070-userdebug
#One-click compilation
./build.sh -AUCKu

Compilation parameter description

				
					./build.sh -UCKAu
(WHERE: -U = build uboot
       -C = build kernel with Clang
       -K = build kernel
       -A = build android
       -p = will build packaging in IMAGE
       -o = build OTA package
       -u = build update.img
       -v = build android with 'user' or 'userdebug'
       -d = huild kernel dts name
       -V = build version
       -J = build jobs
   ------------Can be used as needed------------------
）

4.4.2 Compilation Products

The flash package uses update.img. After complete compilation, the following files will be generated:

				
					rockdev/Image-rk3588_ds070/
├── boot-debug.img
├── boot.img
├── config.cfg
├── dtbo.img
├── MiniLoaderAll.bin
├── misc.img
├── parameter.txt
├── pcba_small_misc.img
├── pcba_whole_misc.img
├── recovery.img
├── resource.img
├── super.img
├── uboot.img
├── update.img
           └── vbmeta.img

4.4.3 Commonly used interfaces

4.4.3.1 Wifi

Enter the Android system, click Settings, enter the network configuration, click Wi-Fi to configure the Wi-Fi account and password, and connect to Wi-Fi.

4.4.3.2 Ethernet

Plug in the network cable, enter the Android system, select Ethernet, and view the Ethernet information.

4.4.3.3 LED

				
					EnterMachine command: adb shell
Switch rootCommand: su

				
					#Turn on wifiled
echo 1 > /sys/class/leds/wifi_led/brightness
Turn off wifiled
echo 0 > /sys/class/leds/wifi_led/brightness

				
					Turn on the Bluetooth LED
echo 1 > /sys/class/leds/bt_led/brightness
Turn off bluetooth led
echo 0 > /sys/class/leds/bt_led/brightness

4.4.3.4 Audio

Connect the speakers, install NetEase Cloud Music or other music player software, and play songs.

4.4.3.5 Bluetooth

Enter the Android system, click Settings, enter Connect Device, select Bluetooth to turn on, and scan and connect.

4.4.3.6 RTC

Enter adb shell, enter hwclock to view the rtc time su ; hwclock

4.4.3.7 Solid State Drive

Enter the Android system, Settings->Storage, you can view the SSD information③

③: The solid state drive needs to be formatted in the system when used for the first time.
In the resource manager, you can see that there is an additional USB folder, which is the solid-state drive that has just been added.

4.4.3.8 Fan

The fan is automatically controlled by the system according to the temperature, with 5 levels in total:

temperature	Fan position
<50	closure
50~55	1
55~60	2
60~65	3
65~70	4
>70	5

Install large software that consumes CPU on the device and check the temperature changes and fan speed changes.

				
					# Check CPU temperature
cat /sys/class/thermal/thermal_zone*/temp
#If the temperature exceeds different ranges, the fan enters different gears
#Fan sys directory path
/sys/devices/platform/pwm-fan/hwmon/hwmon12/

5. Relevant standards and certifications

5.1 Hazardous Substance Standards

5.1.1 ROHS

Chinese Standard: GB/T 26572-2011
EU Standard: Directive 2011/65/EU
Remark:The components used in current products comply with ROHS standards

5.1.2 REACH

EU Standard: EU Regulation (EC) No 1907/2006 (REACH)
Remark:The components used in the current products comply with REACH standards

5.2 EMC implementation standards

EU standards: EN55032:2015+ A11:2020/EN55035:2017 + A11:2020/ETSI EN 301489-1 V2.2.3(2019-11)/ETSI EN 301489-X
Chinese Standard: GB/T 17625
Remark:Current products are designed strictly in accordance with EMC standards

5.3 Authentication Support

5.3.1 Proxy Client Authentication

The customer only needs to provide the application company information, and Dusun will be responsible for all the certification processes
The certification process is shown in the following example (CE certification):

5.3.2 Customer Self-Authentication

① Dusun provides certification related materials, the list of materials is as follows (contact the project leader, who will coordinate and organize the materials):

BOM list (all in English)
Body Label
Block diagram
Parts placement
PCB layout
Schematic diagram SCH
User manual
Antenna Specifications
List of key safety components (with safety component certificates, such as relays, fuses, terminal blocks, etc.)
PCB-UL certificate

② Dusun provides certification technical support (fixed frequency, safety regulations, EMC)
Contact the project leader, who will coordinate with relevant technical personnel to provide technical support

6. Order

6.1 Model Description

Please contact sales if you need customization.

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DSGK-070 Surveying and mapping robot motherboard

1. Product Introduction

2. Installation Instructions

3. Hardware Instructions

4. Software Instructions

5. Relevant standards and certifications

6. Order

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