1. Introduction
DSM-103 is a low-power embedded Z-WAVE module. It is composed of a highly integrated wireless chip EFR32ZG23A020F512GM40-C and some peripheral devices, and supports Z-WAVE and Z-WAVE long range protocols.
The product has two antenna connection methods. The default is IPEX socket connection method, and it can also be extended to the motherboard through the port. There are also two ways to connect to the motherboard. One is directly attached to the motherboard, and the other uses standard 1.27-pitch connectors and Motherboard connection supports global frequency bands.
- Low Power Z-Wave Wireless SoC
- 32-bit ARM® Cortex®-M33 core with 78 MHz maximum operating frequency
- Up to 512 kB of flash and 64 kB of RAM
- Integrated sub-GHz PA with up to 20 dBm TX power
- Integrated LNA with RX Sensitivity as low as -109.8 dBm.
- Secure Element with Secure Vault
- 4.0 mA RX current at 868 MHz (9.6 kbps FSK)
- 4.0 mA RX current at 868 MHz (100 kbps GFSK)
- 4.0 mA RX current at 908.42 MHz (9.6 kbps FSK)
- 4.0 mA RX current at 916 MHz (100 kbps GFSK)
- 9.8 mA TX current @ 0 dBm output power at 916 MHz
- 25.0 mA TX current @ 14 dBm output power at 916 MHz
- 85.5 mA TX current @ 20 dBm output power at 916 MHz
- 26 μA/MHz in Active Mode (EM0) at 39.0 MHz
- 1.5 μA EM2 DeepSleep current (64 kB RAM retention and RTC running from LFXO)
- 1.2 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)
DSM-103 has 2 columns of Pins (2* 14).The distance between each Pin is 1.27±0.1mm.
Size: 17±0.35 mm (W) x 22±0.35 mm (L) x 2.8±0.15 mm (H).
| Pin Number | Symbol | IO Type | Function |
|---|---|---|---|
| 1 | GND | P | Power supply reference ground pin |
| 2 | ANT | RF | RF signal input/output port, which corresponds to ANT of IC |
| 3 | GND | P | Power supply reference ground pin |
| 4 | NC | Not connect | |
| 5 | NC | Not connect | |
| 6 | PD13 | I/O | Corresponding to PD13 of IC |
| 7 | PD14 | I/O | Corresponding to PD14 of IC |
| 8 | PD15 | I/O | Corresponding to PD15 of IC |
| 9 | PB11 | I/O | Corresponding to PB11 of IC |
| 10 | PB12 | I/O | Corresponding to PB12 of IC |
| 11 | PB13 | I/O | Corresponding to PB13 of IC |
| 12 | PB14 | I/O | Corresponding to PB14 of IC |
| 13 | PB15 | I/O | Corresponding to P15 of IC |
| 14 | NC | Not connect | |
| 15 | NC | Not connect | |
| 16 | NC | Not connect | |
| 17 | PF3 | I/O | Corresponding to PF3 of IC |
| 18 | PF2 | I/O | Corresponding to PF2 of IC |
| 19 | NC | Not connect | |
| 20 | GND | P | Power supply reference ground pin |
| 21 | VCC | P | Power supply pin (3.3V) |
| 22 | RX0 | I | Corresponding to internal RXD0 of IC |
| 23 | TX0 | O | Corresponding to internal TXD0 of IC |
| 24 | SWDIO | I/O | Corresponding to internal SWDIO of IC |
| 25 | SWCLK | I/O | Corresponding to internal SWCLK of IC |
| 26 | PC11 | I/O | Corresponding to PC11 of IC |
| 27 | PC10 | I/O | Corresponding to PC10 of IC |
| 28 | nRESET | I | Hardware reset pin, which is at a high level by default and is active at a low level |
2. Electrical Characteristics
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Storage temperature range | TSTG | -50 | — | +150 | °C | |
| Voltage on any supply pin | VDDMAX | -0.3 | — | 3.8 | V | |
| Junction temperature | TJMAX | -G grade | — | — | +105 | °C |
| -I grade | — | — | +125 | °C | ||
| Voltage ramp rate on any supply pin | VDDRAMPMAX | — | — | 1.0 | V / µs | |
| Voltage on HFXO pins | VHFXOPIN | -0.3 | — | 1.2 | V | |
| DC voltage on any GPIO pin1 DC voltage on RESETn pin2 Absolute voltage on Sub-GHz RF pins |
VDIGPIN | -0.3 | — | VIOVDD + 0.3 | V | |
| VRESETn | -0.3 | — | 3.8 | V | ||
| VMAXSUBG | SUBG_O pins |
-0.3 | — | 1.2 | V | |
| SUBG_I pins |
-0.3 | — | 3.8 | V | ||
| Total current into VDD power lines | IVDDMAX | Source | — | — | 200 | mA |
| Total current into VSS ground lines | IVSSMAX | Sink | — | — | 200 | mA |
| Current per I/O pin | IIOMAX | Sink | — | — | 50 | mA |
| Source | — | — | 50 | mA | ||
| Current for all I/O pins | IIOALLMAX | Sink | — | — | 200 | mA |
| Source | — | — | 200 | mA |
3. RF Features
This table is for devices with a output power rating of +20 dBm using the 868/915/920 MHz +20 dBm matching network as shown in the typical connections section. Unless otherwise indicated, typical conditions are: TA = 25 °C, VREGVDD = 3.3 V, AVDD = DVDD = IOVDD = RFVDD = 1.8 V powered from DCDC. PAVDD = 3.3V. Crystal frequency= 39.0 MHz. RFVDD and external PA supply paths filtered using ferrites. RF center frequency 916 MHz.
868 MHz Band +20 dBm RF
Table 4.16. 868 MHz Band +20 dBm RF Transmitter Characteristics
4. Antenna
uses an onboard PCB antenna or Ipex antenna.
To ensure optimal Z-WAVE performance when the module uses an onboard PCB antenna, it is recommended that the antenna be at least 5 mm away from other metal parts.
To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antennaarea on the PCB.
5. Firmware
Support customized various product solutions. and provide related API documents and support. Customers can pair the device to the gateway (Dusun gateway or Private gateway )according to the API description and standard protocol.
API content includes reading sensor data, controlling device switches, changing device configuration, OTA, etc.
It can provide the erminal device customization + Dusun gateway overall solution, and can provide the MQTT protocol for the gateway to connect to the customer platform. Customers can easily deploy the entire system and view the status and data of the terminal equipment at any time.
6. Production instruction
Use an SMT placement machine to mount components to the stamp hole module that Dusun produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.
| Product Name | Wireless Devices | Firmware version |
|---|---|---|
| DSM-103-1 | Temperature &humidity sensor | DSM-103_T&H sensor.bin |
| DSM-103-2 | Door/window sensor | DSM-103_Beacon.bin |
| DSM-103-3 | PIR | DSM-103_ PIR.bin |
| DSM-103-4 | Leakage | DSM-103_Leakage.bin |
| DSM-103-5 | Plug | DSM-103-Plug.bin |
| DSM-103-6 | Switch(3 gang) | DSM-103-Switch.bin |
| DSM-103-7 | Smoke | DSM-103-Smoke.bin |
| DSM-103-8 | Emergency button | DSM-103-SOS button.bin |
| DSM-103-9 | RGB lighting | DSM-103-lighting.bin |
| DSM-103-10 | Strip(4 gang) | DSM-103-Strip.bin |
- SMT placement equipment: Reflow soldering machine Automated optical inspection (AOI) equipment Nozzle with a 6 mm to 8 mm diameter
- Baking equipment: Cabinet oven Anti-static heat-resistant trays Anti-static heatresistant gloves
- Storage conditions for a delivered module are as follows: The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
The package contains a humidity indicator card (HIC).
- Bake a module based on HIC status as follows when you unpack the module package: If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. If the 30% circle is pink, bake the module for 4 consecutive hours.
If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. - Baking settings:
Baking temperature: 125±5℃
Alarm temperature: 130℃
SMT placement ready temperature after natural cooling: < 36℃
Number of drying times: 1
Rebaking condition: The module is not soldered within 12 hours after baking. - Do not use SMT to process modules that have unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Dusun is not liable for such problems and consequences. - Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection andAOI.
7. Recommended oven temperature curve
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
Please refer to the recommended furnace temperature setting for wave soldering, the peak temperature is 260℃±5℃, and the wave soldering temperature curve is shown in the figure below:
8. Storage conditions
9. packing
| Product type | MOQ | Packing method | Number of Modules in Each Reel Pack | Number of Reel Packs in Each Box |
|---|---|---|---|---|
| DSM-103 | 4000 | Carrier tape and reel packing | 1000 | 4 |
