1. Introduction of DSM-059 Low Power Bluetooth Module
DSM-059 is a low power BLE module powered by Dusun IoT. The DSM-059 BLE 5.0 module is high performance wireless transparent transmission module based on the Chipsea CST92F25 chip and conforms to the BLE standard design published by SIG.
The control mode of this low power Bluetooth module module is flexible, which can be controlled not only through serial port and pins, but also supports remote control via mobile terminal. When using this module, users can develop standard BLE products in a short time without having to worry about the complex Bluetooth protocol.
- Built-in ARM Cortex-M0 CPU, main frequency up to 64MHz
- 8KB code cache
- 64KB Data RAM
- Integrate 512KB Flash
- Working voltage: 1.8 V to 3.6 V
- Peripherals: 1XUART
- Bluetooth RF feature
802.15.4 MAC/PHY supported
Compatible with BLE 5.0
TX power:-20 to +5 dBm
RX sensitivity:
-93dBm@1Mbps
-90dBm@2Mbps - Dimension: 17 x 22 x 2.8 mm
- Working temperature: –40°C to +85°C
- Working Humidity: <93%(non-condensing)
- Certification BQB, SRRC
- Smart Building Automation
- Smart Home Automation Hub
- Industrial Wireless Control
- Intelligent Public Traffic
- RPM Remote Patient Monitoring Solution
- Web Camera
- Baby Monitor
2. Mechanical Requirement of DSM-059 BLE 5.0 Module
Dimensions: 12.45±0.2 mm (W) x 10.4±0.2 mm (L) x 10.4±1.5 mm (H).
| Pin Number | Symbol | IO Type | Function |
|---|---|---|---|
| 1 | GND | P | Ground |
| 2 | ANT | I | Antenna input |
| 3 | GND | P | Ground |
| 4 | VCC | P | Power supply pin (3.3V) |
| 5 | EN | I/O | Enabling pin, which works at the high level and is pulled up 0: The module starts broadcasting until it connected to the mobile device 1: Immediately enter into the sleep state regardless of the current state of the module |
| 6 | RXD | I | Serial port input pin, corresponds to GPI02 of the IC chip |
| 7 | TXD | O | Serial port input pin, corresponds to GPI03 of the IC chip |
| 8 | P06 | I | Restore Factory Setting triggers: 30 seconds after power on, This pin keep low level for 5 s, the system can recover some parameters (shallow recovery), if it could keep more than 20 s will restore all parameters. |
| 9 | P07 | I/O | Programmable I/O port |
| 10 | GND | P | Ground |
| 11 | RESET | I/O | Hardware reset pin, which is at a high level by default and is active at a low level |
| 12 | TCK | I/O | Interface for debugging: debug clock input |
| 13 | TMS | I/O | Interface for debugging: debug data |
•P indicates power supply pins, I/O indicates input/output pins
3. Electrical Parameters of DSM-059 Low Power BLE Module
| Parameter | Description | Typical value |
Minimum value | Maximum value | Unit |
|---|---|---|---|---|---|
| Ts | Storage temperature | -55 | 150 | ℃ | |
| VCC | Power supply voltage | 1.8 | 3.6 | V | |
| Static electricity voltage (human body model) | TAMB-25℃ | - | 2 | KV | |
| Static electricity voltage (machine model) | TAMB-25℃ | - | 0.5 | KV |
| Parameter | Description | Minimum value | Maximum value | Typical Value |
Unit |
|---|---|---|---|---|---|
| Ta | Working temperature | -40 | 85 | - | ℃ |
| VCC | Power supply voltage | 1.8 | 3.6 | 3.0 | V |
| VIL | I/O low-level input | - | 0.3 | - | V |
| VIH | I/O high-level input | VDD-0.3 | VDD+0.3 | - | V |
| VOL | I/O low-level output | - | 0.3 | - | V |
| VOH | I/O high-level output | I0VDD-0.3 | VDD+0.3 | - | V |
NOTE: VCC=3.0V, Tamb=-10~70℃
| Parameter | Min Value | TYP Value | MAX Value | Unit | |
|---|---|---|---|---|---|
| Sleep Mode，32K RTC running，all the internal of SRAM retain ，can be woken up by RTC time or IO | 6 | uA | |||
| OFF Mode，can only be woken up by the IO | 0.7 | uA | |||
| MCU operation current | System clock 16MHz，RF NOT Work，with DC-DC | 2.2 | mA | ||
| System clock 48MHz，RF NOT Work，with DC-DC | 2.8 | mA | |||
| System clock 64MHz，RF NOT Work，with DC-DC | 3.2 | mA | |||
| System clock 16MHz，RF NOT Work，without DC-DC | 3.9 | mA | |||
| System clock 48MHz，RF NOT Work，without DC-DC | 5.2 | mA | |||
| System clock 64MHz，RF NOT Work，without DC-DC | 6 | mA | |||
| RX Mode | System clock 16MHz，with DC-DC | 5 | mA | ||
| System clock，with DC-DC | 6 | mA | |||
| System clock，with DC-DC | 6.4 | mA | |||
| System clock，without DC-DC | 8 | mA | |||
| System clock，without DC-DC | 9 | mA | |||
| System clock，without DC-DC | 9.8 | mA | |||
| TX Mode | 0dBm output，System clock 16MHz，with DC-DC | 5.5 | mA | ||
| 0dBm output，System clock 48MHz，with DC-DC | 6.5 | mA | |||
| 0dBm output，System clock 64MHz，with DC-DC | 7 | mA | |||
| 0dBm output，System clock 16MHz，without DC-DC | 8.5 | mA | |||
| 0dBm output，System clock 48MHz，without DC-DC | 9.3 | mA | |||
| 0dBm output System clock 64MHz，without DC-DC | 10.2 | mA | |||
4. Basic Requirement of DSM-059 Low Power Bluetooth Module
Entering into the test mode via serial commands
FA FB AF 01 01 FF A5 //Mode 1 test Calibration
FA FB AF 01 01 F0 96 //Mode 2 Single Carrier 2402MH 0dbm
FA FB AF 01 01 F1 97 //Mode 3 Single Carrier 2440MHz 0dbm
Case 1: Entering into mode 2 or 3, transmitting a single carrier, exiting after the 10S
Case 2: Entering into mode 1, when no calibration parameter is sent, it will exit after the 10s.
Case 3: Entering into mode 1, when the calibration parameter is sent. It will Perform calibration parameters after a single carrier, finally, it will exit after the 10s.
The module supports OTA Firmware updates via phone or other hosts.
Reserved burning firmware interface is available. The burning pin spacing is 2.54MM supporting chip upgrade via OTA.
5. Antenna of DSM-059 Low Power Bluetooth Module
The 50 ohm impedance line is leaded to the bonding pad of the module.
To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance.
6. Certification of DSM-059 Low Power Bluetooth Module
BQB, SRRC
7. Instructions of DSM-059 Low Power Bluetooth Module
1). Use an SMT placement machine to mount components to the stamp hole module that DUSUN produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum packs the module again. Bake the module before mounting components to the module.
- SMT placement equipment:
Reflow soldering machine
Automated optical inspection (AOI) equipment
Nozzle with a 6 mm to 8 mm diameter - Baking equipment:
Cabinet oven
Anti-static heat-resistant trays
Anti-static heat-resistant gloves
2). Storage conditions for a delivered module are as follows:
- The moisture-proof bag is placed in an environment where the temperature is below 30℃ and the relative humidity is lower than 70%.
- The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
- The package contains a humidity indicator card (HIC).
3). Bake a module based on HIC status as follows when you unpack the module package:
- If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
- If the 30% circle is pink, bake the module for 4 consecutive hours.
- If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
- If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
4). Baking settings:
- Baking temperature: 125±5℃
- Alarm temperature: 130℃
- SMT placement ready temperature after natural cooling: < 36℃
- Number of drying times: 1
- Rebaking condition: The module is not soldered within 12 hours after baking.
5). Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Roombanker is not liable for such problems and consequences.
6). Before SMT placement, take electrostatic discharge (ESD) protective measures.
7). To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245℃.
Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
8. MOQ and Packing of DSM-059 Low Power Bluetooth Module
| Product model | MOQ（pcs） | Packing method | Number of Modules in each reel pack | Number of reel packs in each box |
|---|---|---|---|---|
| DSM-059 | 8000 | Carrier tape and reel packing | 2000 | 4 |
