1. Overview of DSOM-070N NXP I.MX 8M Mini SoM
The DSOM-070N I.MX 8M Mini System on Module is developed based on NXP’s multicore embedded applications processor, featuring a quad-core ARM Cortex-A53 that operates at up to 1.8GHz and a 400MHz Cortex-M4 processor. It employs sophisticated 14LPC FinFET process technology to deliver superior speed and improved power efficiency.
The standard memory and storage configuration consists of 2GB DDR4, 8GB eMMC, and 32MB QSPI flash. Optional configuration for RAM and eMMC avaliable.
DSOM-070N I.MX 8M Mini SoM incorporates GigE PHY and PMIC. Various peripherals and I/O signals can be accessed via two 0.8mm pitch 100-pin board-to-board expansion connectors.
DSOM-070N I.MX 8M Mini system on module is compatible with Linux and Android OS. It is designed to provide an accessible and efficient development experience for developers by offering a wide array of free and open-source resources, aiming to make product development more convenient, efficient, and less risky.
DSOM-070N NXP I.MX 8M Mini System on Module (SOM) is compact in size, measuring only 60mm * 49mm. It is a cost-effective NXP SoM used for developing IoT edge computing, industrial real-time control, industrial data acquisition and control, and IoT predictive maintenance.
- Featuring a compact form factor and sufficient GPIO interfaces
- Size 60mm*49mm，board to board connector
- With VPU and GPU
- Rich extension interfaces, supporting PCIE2.0, Gigabit Ethernet, SAI, I2C, UART, SDIO3.0, MIPICSI, MIPI-DSI, SPDIF, USB2.0, SPI, etc.
- eMMC up to 16GB
- RAM up to 2GB
- 8-layer board to board connector, produced by sinking gold technology, independent
grounding signal layer, lead-free - Leads out 200 PIN pins, including almost all CPU pins.
- RoHS certified
- Camera video monitoring
- Two-way video conference
- Visual doorbell
- Image analysis
- Home display
- Wireless or networked speakers
- Home appliance system control
- Sound amplification device system
2. System Block Diagram of DSOM-070N NXP I.MX 8M Mini SoM
3. Basic Parameters and Interfaces of DSOM-070N NXP I.MX 8M Mini SoM
| Item | Parameter |
|---|---|
| CPU | Quad Cortex®-A53 processors operation up to 1.6 GHz Cortex®-M4 CPU operating up to 400 MHz |
| GPU | • GCNanoUltra for 3D acceleration • GC320 for 2D acceleration |
| VPU | Video Decode • 1080p60 VP9 Profile 0, 2 (10-bit) • 1080p60 HEVC/H.265 Decoder • 1080p60 AVC/H.264 Baseline, Main, High decoder • 1080p60 VP8 • 1080p60 AVC/H.264 Encoder • TrustZone support |
| RAM | 2GB (1GB/4GB optional) |
| Storage | eMMC 16 GB (8GB / 16GB / 32GB eMMC optional) |
| Operating Voltage | Typical voltage 5V/2.1A |
| Temperature | Operating Temperature: -40 °C ~75 °C (industrial grade) |
| Storage Temperature: -40 °C ~ 85 °C | |
| Humidity | 10~95%(Non-condensing) |
| Barometric Pressure | 76Kpa ~106Kpa |
| Size | 60mm × 49mm × 1.2mm |
| Peripheral | Description |
|---|---|
| USB 2.0 | 2 X USB2.0 OTG |
| PCIE | 1 X PCIE, Supports 1-way PCI Express Gen2.0 |
| MIPI CSI | 1 X MIPI CSI，Provide a four-lane MIPI camera serial interfaces, capable of operating up to 1.5 Gbps |
| MIPI DSI | 1 X MIPI DSI，Provide a four-lane MIPI display serial interface, capable of
operating up to 1.5 Gbps • 1080 p60 |
| Ethernet | 1 X 10/100/1000Mbps PHY |
| SDIO | 2 X SDIO |
| UART | 4 X UART , The maximum supported baud rate is 4Mbp |
| SPI | 3 X SPI , the master-slave mode can be configured |
| I2C | 3 X I2C, The maximum speed supported in standard mode is 100Kbit/s; The maximum supported speed in fast mode is 320Kbit/s |
| SAI | 5 X SAI, supporting I2S, AC97, TDM, codec/DSP, and DSD interfaces, including one SAI with 8 Tx and 8 Rx lanes, one SAI with 4 Tx and 4 Rx lanes, two SAI with 2 Tx and 2 Rx lanes, and one SAI with 1 Tx and 1Rx lane. Support over 20 channels of audio subject to I/O limitations |
| SPDIF | 1 X SPDIF，A standard audio file transfer format, developed jointly by the Sony and Phillips corporations. It supports Transmitter and Receiver functionality. |
| PWM | 4 X PWM，The pulse-width modulator (PWM) has a 16-bit counter and is optimized to generate sound from stored sample audio images. It can also generate tones. It uses 16-bit resolution and a 4x16 data FIFO to generate sound. |
| QSPI | 1 X QSPI，Already occupied by the core board, connected to 32MB of Nor Flash |
| Upgrade | Supports local firmware upgrades via USB interface |
4. Pin Definition of DSOM-070N NXP I.MX 8M Mini SoM
5. Electrical Parameters of DSOM-070N NXP I.MX 8M Mini SoM
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| VCC_SYS | Input Voltage | -0.3 | 6.0 | V | |
| Ta | Operating temperature range | -40 | 25 | 75 | ℃ |
| Ts | Store temperature range | -40 | 25 | 125 | ℃ |
Note: Exposure to conditions beyond the absolute maximum ratings may cause permanent damage and affect the reliability and safety of the device and its systems. The functional operations cannot be guaranteed beyond specified values in the recommended conditions.
| Parameter | Description | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| VCC_5V | Input Voltage | 4.5 | 5 | 5.5 | V |
| Temperature | Operating temperature range | -40 | 25 | 75 | ℃ |
| Store temperature range | -40 | 25 | 85 | ℃ | |
| Humidity | Operating humidity range | 10 | 80 | %RH | |
| Store humidity range | 10 | 90 | %RH |
| Working conditions | Supply voltage(unit: V) | Average current(unit: mA) | Peak current(unit: mA) | Total power consumption(unit: mW) |
|---|---|---|---|---|
| During boot | 5 | 110 | 130 | 550 |
| Full-load stage | 5 | 420 | - | 2100 |
| Mem low power mode | 5 | 10 | - | 50 |
| Freeze low power mode | 5 | 90 | - | 450 |
6. Dimensions of DSOM-070N NXP I.MX 8M Mini SoM
| Item | Parameter |
|---|---|
| Exterior | Board To Board Connectors |
| Core Board Size | 60mm X 49mm X 2.4mm |
| Pin Spacing | 0.8 |
| Number of Pins | 200 Pins |
| Number of Layers | 8 layers, produced by gold sinking process, lead-free |
| Warpage | less than 0.5 % |
7. Production Guide of DSOM-070N NXP I.MX 8M Mini SoM
Select modules that can be SMT or in-line packaged according to the customer’s PCB design scheme. If the board is designed for SMT packaging, use SMT-packaged modules. If the board is designed for in-line assembly, use in-line assembly. Modules must be soldered within 24 hours of unpacking. If not, place them in a dry cabinet with a relative humidity of no more than 10% or repack them in a vacuum and record the exposure time (total exposure time must not exceed 168 hours).
Instruments or equipment required for SMT assembly：
- SMT Mounter
- SPI
- Reflow soldering
- Oven temperature tester
- AOI
Instruments or equipment required for baking:
- Cabinet ovens
- Antistatic high-temperature trays
- Antistatic and high-temperature gloves
Moisture-proof bags must be stored at a temperature <40°C and humidity <90% RH. Dry-packed products have a shelf life of 12 months from the date of sealing of the package. Sealed packaging with humidity indicator card.
The vacuum bag is found to be broken before unpacking.
After unpacking, the bag is found to be without a humidity indicator card.
The humidity indicator card reads 10% or more after unpacking, and the color ring turns pink. Total exposure time after unpacking exceeds 168 hours.
More than 12 months from the date of the first sealed packaging.
Baking parameters are as follows:
Baking temperature: 60°C for reel packs, humidity less than or equal to 5% RH; 125°C for tray packs, humidity less than or equal to 5% RH (high-temperature-resistant trays, not blister packs for tow trays).
Baking time: 48 hours for reel packaging; 12 hours for pallet packaging.
Alarm temperature setting: 65°C for reel packs; 135°C for pallet packs.
After cooling to below 36°C under natural conditions, production can be carried out.
If the exposure time after baking is greater than 168 hours and not used up, bake again.
If the exposure time is more than 168 hours without baking, it is not recommended to use the reflow soldering process to solder this batch of modules. The modules are class 3 moisture-sensitive devices and may become damp when the exposure time is exceeded. This may lead to device failure or poor soldering when high-temperature soldering is carried out.
Please protect the module from electrostatic discharge (ESD) during the entire production process.
To ensure product qualification rates, it is recommended to use SPI and AOI test equipment to monitor solder paste printing and placement quality
Please follow the reflow profile for SMT placement with a peak temperature of 245°C. The reflow temperature profile is shown below using the SAC305 alloy solder paste as an example.
Description for graphs of curves.
A: Temperature axis
B: Time axis
C: Alloy liquid phase line temperature: 217-220°C
D: Slope of temperature rise: 1-3°C/s
E: Constant temperature time: 60-120s, constant temperature: 150-200°C
F: Time above liquid phase line: 50-70s
G: Peak temperature: 235-245°C
H: slope of temperature reduction: 1-4°C/s
Note: The above recommended curves are based on SAC305 alloy solder paste as an example. Please set the recommended oven temperature curve for other alloy solder pastes according to the solder paste specification.
| Model | RAM | eMMC |
|---|---|---|
| DSOM-070N-2 | 2GB | 16GB |
