DSOM-170N NXP i.MX93 System on Module | Arm® Cortex®-A55 & Cortex-M33

Model: DSOM-170N Category:

The DSOM-170N NXP i.MX93 SOM based on the powerful i.MX 93 family’s i.MX9352 system-on chip (SoC) from NXP offers high computing power with low energy consumption. Measuring only 48 mm x 33 mm, equipped with an Arm® Ethos™-U65 microNPU and based on NXP’s innovative Energy Flex architecture, the module enables the development of powerful, cost-effective and energy-efficient capability for a wide range of medical, industrial, energy and transportation applications, including Internet of Things (IoT), automation, human-machine interface (HMI), equipment monitoring, audio/voice, edge computing and machine learning (e.g. anomaly detection).

  • CPU: 1.7GHz Dual Cortex™-A55 NXP iMX93 processor with 250MHz Cortex-M33 Real-time co-processor
  • NPU: 0.5 TOPS Ethos U-65 microNPU for light Al applications
  • Memory: 1GB LPDDR, 8GB eMMC
  • Interfaces: 8 × UART, 2 × Ethernet (with 1 TSN-capable port), 2 × USB2.0, and 2 × CAN-FD, 1 × 2-lane MIPI-CSI, 1 × 4-lane MIPI DSI
  • Size: 48mm × 33mm × 1.5mm

Samples will be available at the end of 2024/the beginning of 2025.

NXP i.MX93 SoM for Power-Efficient ML Applications

The DSOM-170N NXP i.MX 93 SOM is a power-efficient System on Module based on latest NXP i.MX93 family – equipped with scalable 1.7 GHz Dual-core ARM Cortex-A55™ processor, a real-time ARM Cortex-M33 co-processor and 0.5 TOPS Ethos U-65 microNPU for light Al. Leveraging the Energy Flex Architectur, this SOM offers a perfect balance of performance, energy efficiency, and security, making it an ideal choice for a wide range of energy-efficient edge computing and machine learning applications. Compared to the previous i.MX6 and i.MX8 families, the i.MX93 SoM is ideal for applications requiring edge AI and low power consumption, benefiting from its NPU and energy-efficient design while the i.MX8M Plus SoM strikes a balance between multimedia capabilities and AI processing, making it suitable for applications needing both video processing and machine learning. The i.MX6ULL SoM remains a strong choice for projects that value a stable, mature development environment and don’t require the latest AI functionalities.
dsom 170n imx93 nxp front
dsom 170n imx93 nxp bottom
cpu arm
1-2x Arm Cortex-A55 1.7 GHz
Arm Cortex-M33 250Mhz
npu
Arm® Ethos™
U-65 microNPU, 0.5 TOP/s
architecture
Energy Flex Architecture:
High Reliability & Low Power
interface
Rich Interfaces
ram emmc
1GB LPDDR4
8GB eMMC
safety
Security with EdgeLock® Secure Enclave
board to board factor
Board-to-Board
form-factor
tiny size
Tiny Size
48mm×33mm×1.5mm

High-Performance Multi-core Heterogeneous Architecture

The DSOM-170N NXP i.MX 93 SOM features a heterogeneous processing architecture with Arm Cortex-A55 cores for general processing and a Cortex-M33 core for real-time tasks. This multi-core configuration allows for efficient task management and optimizes performance across various workloads, ensuring responsive and capable processing for complex applications.

multi core architecture
npu ai capability

Lightweight NPU AI Capability at the Edge

Equipped with a lightweight 0,5 Tops Arm Ethos™ U65 microNPU, each cycle with 256 MAC, the DSOM-170N NXP i.MX 93 SOM can meet the demand for high efficient, fast and safe machine learning at edge side, critical for applications requiring immediate responsiveness and reduced latency, without the need for cloud-based AI services.

High Reliability and Low Power Design with Energy Flex Architecture

Designed with energy efficiency at its core, the DSOM-170N NXP i.MX 93 SOM utilizes Energy Flex architecture to optimize power consumption without compromising on performance. This ensures long-lasting operation and reliability, especially in energy-sensitive environments, reducing operational costs and extending device lifespan.

dsom 170n imx9 energy flex architecture

Rich Interface and Reliable Connectivity Options

The system on module offers a comprehensive set of interfaces, including multiple USB, UART, SPI, I2C, and GPIOs, and two Gigabit Ethernet ports—one of which is enabled with Time-Sensitive Networking (TSN) for precision and reliability in networked communications. This, along with other connectivity options such as Wi-Fi, Bluetooth, and extensive storage configurations, addresses diverse application needs and supports data-intensive operations. In addtion, the iMX93 SoM also suooprt single dual-lane MIPI-CSI interface for high-speed camera and imaging integration.

dsom 170n imx93 rich interface

Embedding ground-breaking security with EdgeLock® Secure Enclave

The DSOM-170N NXP i.MX 93 SoM incorporates state-of-the-art security measures with the NXP EdgeLock® secure enclave, which provides a pre-configured security subsystem that simplifies implementation of complex security and helps designers avoid costly implementation errors, ensuring data integrity, device authentication, and privacy protection, critical for maintaining secure communications and safeguarding sensitive information in IoT systems.

dsom 170n edgelock secure enclave

Custom Development and Embedded Board Services

Need More Than Just a System on Module? Talk to us about Single Board Computers, Complete Products and Customized Solutions Services.

SoMs Secondary Development

Providing a stable hardware platform that has been tested by the market to help partners shorten the productization cycle and quickly complete product development.

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Requirements & Product Confirmation
icon validation
Validation of SoM Functionality
icon carrier board
Carrier Board Development & Guidance
icon prototyping
Product Prototyping & Debugging
icon mass
Mass Production & Shipment
Embedded Mainboard ODM / EMS

With decades of experience in AIoT hardware design, Dusun IoT focuses on providing zero-to-one embedded mainboard design and development services for Appliances, Electrical, and Electronics Manufacturers and software developer customers.

design rd Manufacturing

i.MX 93 Processor Block Diagram

imx93 block diagram dsom 170n

Basic Parameters and Interfaces of DSOM-170N NXP i.MX93 System on Module

Item Parameter
CPU NXP i.MX9352
MPU: Cortex-A55 @1.5GHz
MCU: Cortex-M33 @250 MHz
NPU: 0.5 TOPS
RAM 1GB LPDDR
ROM 8GB eMMC
Operating Voltage Typical voltage 5V
Temperature Operating Temperature: -40°C~85°C
Storage Temperature: -40°C~85°C
Humidity 10~90% (Non-condensing)
Barometric Pressure 76Kpa~106Kpa
Size 48mm×33mm×1.5mm
Item QTY Parameter
LCD 1 Parallel RGB888, up to 1366×768p60 or 1280×800p60
LVDS 1 Single 4-lane supports 720p60, up to 1366×768p60 or 1280×800p60
MIPI-DSI 1 1x 4-lane MIPI DSI
Compatible with MIPI-DSI V1.2 and MIPI D-HPY V1.2
Pixel clock up to 200MHz, and pixel filling rate 140 MP/s, 24-bit
Supports resolution of 1080p60 or 1920x 1200p60, each lane up to 1.5GHz
Ethernet ≤2 2x RGMII with one supports TSN;
Ethernet with TSN supports QoS, supports 802.1Qbv and 802.1QbuTransmission rate 10/100/1000 Mbps, complies with IEEE 802.3
UART ≤8 Baud rate up to 5Mbps
≤2 Supports CAN-FD and CAN 2.0B
USB ≤2 Two USB2.0 controllers integrated with PHY
SD card slot ≤1 Complies with SD3.0;
Supports SDR up to 200MHz and DDR up to 50MHz
SDIO ≤1 Complies with SDIO3.0
SAI ≤3 SAI1 supports 2 lanes, SAI2 supports 4 lanes, and SAI3 supports 1 lane;
Full-duplex serial supports frame synchronization, such as I2S, AC97, TDMandcodec/ DSP
SPDIF 1 Supports original capturing mode;
Supports L-PCM and IEC61937 forms
PDM 1 24-bit, supports linear phase response and AOP MIC
MIPI-CSI 1 Compiles both MIPI CSI-2 V1.3 and MIPI D-PHY V1.2;
Supports up to 2 RX data lanes (and 1 RX clock lane)
Pixel clock up to 200MHz, pixel filling rate up to 150MP/s under rated voltageandoverspeed voltage;
80Mbps~1.5 Gbps under high-speed mode, and 10Mbps rating under lowpower mode
SPI ≤8 Supports to configure master and slave modes
I2C ≤8 Rating up to 100Kbit/s in standard mode, and 400Kbit/s in fast-speed mode, 1000Kbit/ sinenhanced fast-speed mode, 3400Kbit/s in high-speed mode, and 5000Kbit/s in super fast speed mode.
I3C ≤2 Supports 400Kbit/s fast speed mode and 1000Kbit/s enhanced fast speed mode, backwardcompatible with I2C.
ADC ≤4 One 12-bit 4-lane 1MS/s ADC
JTAG 1 For M33 core debugging

Wide Range of Applications

The i.MX 93 SoM adopts the NXP’s latest power-optimized processors for smart home, building control, contactless HMI, IoT edge, Automotive, and Industrial applications

hmi dusun applications
HMI (Human Machine Interface)

The IMX93 processor features a 4-lane MIPI-DSI display interface supporting 1080p60 resolution and an efficient pixel pipeline, enabling high-quality graphical user interfaces suitable for human-machine interface applications. Additionally, it integrates an Arm Ethos-U65 micro NPU to enhance performance and efficiency for machine learning applications, supporting more intelligent user interactions.

automotive dusun applications
Automotive

The IMX93 processor is suitable for automotive applications due to its dual Arm Cortex-A55 cores running at up to 1.7 GHz, providing reliable and efficient processing power for automotive systems. Additionally, it features advanced connectivity options like CAN-FD and Gb Ethernet with AVB and TSN support, making it ideal for vehicle communication and networked control systems.

industrial automation dusun applications
Industrial Automation
  • Industrial machine vision
  • Industrial scanning
  • Industrial HMI
  • Industrial gateway
  • I/O control
building control dusun applications
Building Control and Energy
  • Access control
  • Energy meter
  • Energy grid equipment
  • EV charging station
  • Environmental control
  • Sensor hub
smart home dusun applications
Smart Home
  • Smart doorbell
  • Smart lock
  • Smart home hub/hue
  • Bridge
smart city dusun applications
Smart City
  • Smart lighting
  • Traffic control
automation dusun applications
Automation
  • Driver monitoring system (DMS)
  • Object Monitoring System
  • Cost optimized gateway
  • General purpose compute

Additional information

RAM

1GB

Flash

8GB

Operating Temperature

-40℃~85℃

Product Type

SoM

Chip Platform

NXP

System support

Linux

CPU Name

i.MX9352

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